ICF13B

13th International Conference on Fracture June 16–21, 2013, Beijing, China -10temperature of conductors increases when high voltage is applied and that the electric field intensity and electric displacements intensity is obtained in the first solution. The power of point heat source of functionally graded piezoelectric strip is deduced. Therefore, from the time integration of power equations of point heat source, the temperature field around the crack tip is calculated. It is worth noting that the problem of a cracked functionally graded piezoelectric strip under electric shock is a mix mode crack problem. The first problem is an electromechanical coupling problem. And the second problem is the temperature field around the crack tip, which is the basis problem of mode I or II heat crack analysis. Acknowledgements The work is supported by the National Natural Science Foundation of China (10962008; 51061015; 11261045) and Research Fund for the Doctoral Program of Higher Education of China (20116401110002). References [1] B.L. Wang, N. Node. Thermally induced fracture of a smart functionally graded composite structure. Theoretical and Applied fracture Mechanics 35 (2001) 93-109. [2] Y.D. Li, K.Y. Lee. Anti-plane fracture analysis for the weak-discontinuous interface in a non-homogeneous piezoelectric bi-material structure. European Journal of Mechanics A/Solids 28 (2009) 241-247. [3] S.H. Ding, X. Li. Crack problem for a functionally graded piezoelectric strip bonded to a functionally graded piezoelectric material. Journal of Lanzhou University (Natural Sciences), 44 (2008) 102-107. (in Chinese) [4] P.P. Shi, S. Sun, X. Li. Arc-shaped interfacial crack in a non-homogeneous electro-elastic hollow cylinder with orthotropic dielectric layer. Meccanica 2012; doi: 10.1007/s11012-012-9610-x [5] S. B. Bilyk, K. T. Ramesh, T. W. Wright. Numerical modeling of electro-mechanical interactions in mental cylinders, Mechanics of Electro-magnetic Materials and Structures, Eds: J.Y. Yang, G.A. Maugin. (2000)1-16 [6] Li X. Integral equation. Beijing: Science Press; 2008. [7] Y.D. Hu, X.Z. Bai. Stress field around crack tips in a thin current carrying plate. Journal of Mechanical Strength 24 (2002) 98-100 (in Chinese)

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