13th International Conference on Fracture June 16–21, 2013, Beijing, China -8- 0 200 400 600 800 1000 0 5 x/h w/h ε 1 = 0.00758, b = 0 0 200 400 600 800 1000 0 5 10 x/h w/h ε 2 = 0.00761, b = 11h 0 200 400 600 800 1000 0 10 20 x/h w/h ε 3 = 0.00762, b = 49.8h 0 200 400 600 800 1000 0 10 20 30 x/h w/h ε 4 = 0.0097, b = 116.8h Figure 9. Out-of-plane displacement of the film (solid lines) and the substrate surface (dashed lines) at four different nominal strains: (a) ε = 0.00758; (b) ε = 0.00761 (b = 11h); (c) ε = 0.00762 (b = 49.8h); (d) ε = 0.0097 (b = 116.8h). 4. Summary Cohesive interface elements are employed in finite element analysis to simulate initiation and growth of wrinkle-induced delamination of an elastic thin film on a compliant substrate. The critical strain for initiation of wrinkle-induced delamination compares closely with an analytical formula based on a strength criterion. Subsequent growth of the delamination crack depends on the interface toughness. Co-evolution of wrinkling and buckle-delamination is simulated using a sufficiently large model. The interaction between the two buckling modes is elucidated. Acknowledgements This work was supported by Semiconductor Research Corporation (SRC). References 1. Rogers, J.A., Someya, T., Huang, Y., 2010. Materials and Mechanics for Stretchable Electronics. Science 327, 1603-1607. 2. Chung, J. Y., Nolte, A.J., Stafford, C.M., 2011. Surface wrinkling: a versatile platform for measuring thin-film properties. Advanced Materials 23, 349-368.
RkJQdWJsaXNoZXIy MjM0NDE=