ICF13B

13th International Conference on Fracture June 16–21, 2013, Beijing, China -9- [3] O'brien M, Rice C. R., Olson D. L., High strength diffusion welding of silver coated base metals. Welding Journal, 55 (1976) 25–27. [4] Z. Zhang, G. Q. Lu, Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow. IEEE translations on Electronics Packaging manufacturing, 25 (2002) 279–283. [5] M. Knoerr, S. Kraft, A. Schlitz, Reliability assessment of sintered nano-silver die-attachment for power semiconductors, In: Proceedings of the Electronics Packaging Electronics Packaging Technology Conference (EPTC), 2010, pp. 56– 61. [6] J.G. Bai, G. Q. Lu, Thermo mechanical Thermo mechanical reliability of low-temperature sintered tired silver die-attached SiC power device assembly. IEEE translations on Device Mater. Reliability, 6(2006) 436–441. [7] T. Wang; X. Chen, G. Q. Lu.; Lei, G.; Low-Temperature sintering with Nano-silver paste in Die- Attached interconnection. Journal of electronic materials, 36(2007) 1333–1340 [8] D. J. Yu, X. Chen, G. Chen, G. Q. Lu; Applying Anand model to low-temperature sintered nano-scale silver paste chip attachment. Materials and design, 30(2009) 4574–4579 [9] G. Chen, X. H. Sun, P. Nie, X. Chen, G. Q. Lu, High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films. Journal of electronic materials, 41(2012) 782–790 [10] X. Li, G. Chen, X. Chen, Mechanical property evaluation of nano-silver paste sintered joint using lap-shear test, Soldering & surface mount technology, 24(2012) 120-126 [11] X. Li, G. Chen, X. Chen, High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force, Microelectronics Reliability, 2012 in press [12] Julie A. Bannantine, Jess J. Corner, James L. Handrock, Foundamentals of metal fatigue analysis, Prentice Hall press, New Jersey, 1990.

RkJQdWJsaXNoZXIy MjM0NDE=